- fast switching speed - surface mount device type - moisture sensitivity level 1 - matte tin(sn) lead finish with nickel(ni) underpl ate - pb free and rohs compliant - green compound (halogen free) with suffix "g" on packing code and prefix "g" on date code - case: sot-23 small outline plastic package - terminal: matte tin plated, lead free, solderable per mil-std-202, method 208 guaranteed - high temperature soldering guaranteed: 260 o c/10s - weight: 0.008grams (approximately) symbol unit p d mw v rrm v i frm ma i o ma r ja o c/w t j , t stg o c symbol unit v (br) v i r a pf pf t rr ns document number: ds_s1404011 2 junction capacitance baw56, bav70 v r = 0 v, f = 1 mhz bav99 c j i f = 150 ma v r = 70 v 225mw smd switching diode maximum ratings and electrical characterstics (t a =25 unless otherwise noted) pulse width=1 sec reverse revovery time i f = i r = 10 ma, r l = 100 ? , i rr = 1 ma reverse breakdown voltage i r = 100 a i f = 50 ma - 2.50 1.5 6 70 - -- 1.25 -- - 55 to + 150 max 1.00 min - 556 parameter v f forward voltage i fsm 450 baw56, bav70, bav99 features mechanical data small signal product taiwan semiconductor sot-23 value 70 2 0.5 mean forward current 200 power dissipation repetitive peak forward current non-repetitive peak forward surge current version: h14 pulse width=1 sec 225 reverse leakage current a peak repetitive reverse voltage junction and storage temperature range parameter thermal resistance form junction to ambient v
(ta=25 unless otherwise noted) document number: ds_s1404011 small signal product baw56, bav70, bav99 taiwan semiconductor version: h14 ratings and characteristics curves 0.01 0.1 1 10 100 1000 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 instantaneous forward current (ma) instantaneous forward voltage(v) fig. 1 typucal forward characteristics 1 10 100 1000 10000 0 20 40 60 80 100 120 140 160 180 200 reverse current (na) junction temperature ( o c) fig. 2 leakage current vs. junction temperature v r =20v typical 0 50 100 150 200 250 0 25 50 75 100 125 150 power dissipation (mw) ambient temperature ( o c) fig. 3 power dissipation derating curve
ordering information part no. baw56 bav70 bav99 baw56 bav70 part no. bav99 bav99 bav99 bav99 bav99 bav99 document number: ds_s1404011 small signal product packing code green compound code package packing manufacture code bav99 rf g sot-23 3k / 7" reel rf note: manufacture special control, if empty means n o special control requirement. preferred p/n green compound code manufacture code packing code example description bav99 rf bav99-b0 rf b0 bav99-d0 rf bav99 rfg g d0 bav99-b0 rfg g bav99-d0 rfg g b0 d0 3k / 7" reel 3k / 7" reel 3k / 7" reel rf sot-23 3k / 7" reel rf gg sot-23 sot-23 rf sot-23 3k / 7" reel (note) a4 a7 rf sot-23 rf rf rf rf rf marking a1 a4 a7 a1 baw56, bav70, bav99 taiwan semiconductor version: h14 green compound green compound green compound rf
min max min max a 2.70 3.10 0.106 0.122 b 1.10 1.50 0.043 0.059 c 0.30 0.51 0.012 0.020 d 1.78 2.04 0.070 0.080 e 2.10 2.64 0.083 0.104 f 0.89 1.30 0.035 0.051 g h suggest pad layout z x y c e pin configuration document number: ds_s1404011 dim. unit (mm) baw56, bav70, bav99 taiwan semiconductor package outline dimensions small signal product version: h14 dim. unit (mm) unit (inch) 0.55 ref 0.022 ref 0.1 ref 0.004 ref unit (inch) typ. typ. 2.9 0.114 0.8 0.031 0.9 0.035 2.0 0.079 1.35 0.053
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